Technology |
Multi Layers PCB |
Double sided PCB |
High Frequency Circuit PCB |
Single sided PCB |
Double sided PCB |
Carbon Through Hole PCB |
Material Thickness |
Board Types |
Thickness |
Tolerance |
Board Types |
Thickness |
Tolerance |
FR_4 |
0.8~1.0mm |
+/- 0.15mm |
FR_2 |
1.0~2.5mm |
+/- 0.20mm |
FR_1 |
1.0~2.5mm |
+/- 0.20mm |
1.2~2.5mm |
+/- 0.20mm |
CEM_3 |
1.0~2.5mm |
+/- 0.20mm |
CEM_1 |
1.0~2.5mm |
+/- 0.20mm |
Hole Size |
Plate Through Hole |
+/- 0.05mm |
Plate Through Hole |
+/- 0.127mm |
Non-Plate Through Hole |
+/- 0.05mm |
Non-Plate Through Hole |
+/- 0.127mm |
Track Width / Spacing |
Tolerance From Original Film |
+/- 0.15% |
Tolerance From Original Film |
+/- 0.20% |
Profile |
CNC Routing |
+/- 0.10mm |
Mold Punching |
+/- 0.20mm |
Mold Punching |
+/- 0.20mm |
Solder Resist |
Wet Film SM |
Maxium: 260-C / 5 second / Twice |
Wet Film SM |
Maxium: 230-C / 5 second / Twice |
Thermal Curing SM |
Maxium: 260-C / 5 second / Twice |
Thermal Curing SM |
Maxium: 230-C / 5 second / Twice |
UV Curing SM |
Maxium: 230-C / 5 second / Once |
UV Curing SM |
Maxium: 230-C / 5 second / Once |
Peelable SM |
Maxium: 250-C / 5 second / Once |
Peelable SM |
Maxium: 230-C / 5 second / Once |
V-Grooving |
CNC Routing |
+/- 5 Degree |
+/- 0.15mm |
Mold Punching |
+/- 5 Degree |
+/- 0.50mm |
Mold Punching |
+/- 5 Degree |
+/- 0.50mm |
Warp and Twist |
1.0~1.5mm |
+/- 1.00% Diagonal Length |
1.0~1.5mm |
+/- 1.50% Diagonal Length |
1.6~2.5mm
|
+/- 0.70% Diagonal Length |
1.6~2.5mm
|
+/- 1.00% Diagonal Length |
